Online Junction Temperature Measurement of IGBT Power Modules with Chip-Integrated Sensor
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
Improving reliability and resource efficiency in power electronics increasingly relies on accurate assessment of ageing and precise estimation of the remaining service life. Accurate temperature measurement of power semiconductors during converter operation is essential for these assessments. In this paper, a method for precise monitoring of semiconductor temperature under real operating conditions is investigated, providing a foundation for improved lifetime estimation and reliability assessment.
Details
| Original language | English |
|---|---|
| Title of host publication | 2025 Energy Conversion Congress & Expo Europe (ECCE Europe) |
| Number of pages | 6 |
| ISBN (electronic) | 979-8-3315-6752-1 |
| Publication status | Published - 1 Sept 2025 |
| Peer-reviewed | Yes |
External IDs
| ORCID | /0000-0002-8441-0677/work/199961740 |
|---|---|
| ORCID | /0000-0003-0978-4828/work/199961747 |
| Mendeley | fe8cd6e9-48e8-3d53-9ab5-155b930488ee |
| Scopus | 105027580971 |
Keywords
ASJC Scopus subject areas
Keywords
- IGBT junction temperature, IGBT monitoring, Tj sensor, condition monitoring, on-chip temperature sensing