Online Junction Temperature Measurement of IGBT Power Modules with Chip-Integrated Sensor
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
Improving reliability and resource efficiency in power electronics increasingly relies on accurate assessment of ageing and precise estimation of the remaining service life. Accurate temperature measurement of power semiconductors during converter operation is essential for these assessments. In this paper, a method for precise monitoring of semiconductor temperature under real operating conditions is investigated, providing a foundation for improved lifetime estimation and reliability assessment.
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2025 Energy Conversion Congress & Expo Europe (ECCE Europe) |
| Seitenumfang | 6 |
| ISBN (elektronisch) | 979-8-3315-6752-1 |
| Publikationsstatus | Veröffentlicht - 1 Sept. 2025 |
| Peer-Review-Status | Ja |
Externe IDs
| ORCID | /0000-0002-8441-0677/work/199961740 |
|---|---|
| ORCID | /0000-0003-0978-4828/work/199961747 |
| Mendeley | fe8cd6e9-48e8-3d53-9ab5-155b930488ee |
| Scopus | 105027580971 |
Schlagworte
ASJC Scopus Sachgebiete
Schlagwörter
- IGBT junction temperature, IGBT monitoring, Tj sensor, condition monitoring, on-chip temperature sensing