Online Junction Temperature Measurement of IGBT Power Modules with Chip-Integrated Sensor

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

Improving reliability and resource efficiency in power electronics increasingly relies on accurate assessment of ageing and precise estimation of the remaining service life. Accurate temperature measurement of power semiconductors during converter operation is essential for these assessments. In this paper, a method for precise monitoring of semiconductor temperature under real operating conditions is investigated, providing a foundation for improved lifetime estimation and reliability assessment.

Details

OriginalspracheEnglisch
Titel2025 Energy Conversion Congress & Expo Europe (ECCE Europe)
Seitenumfang6
ISBN (elektronisch)979-8-3315-6752-1
PublikationsstatusVeröffentlicht - 1 Sept. 2025
Peer-Review-StatusJa

Externe IDs

ORCID /0000-0002-8441-0677/work/199961740
ORCID /0000-0003-0978-4828/work/199961747
Mendeley fe8cd6e9-48e8-3d53-9ab5-155b930488ee
Scopus 105027580971

Schlagworte

Schlagwörter

  • IGBT junction temperature, IGBT monitoring, Tj sensor, condition monitoring, on-chip temperature sensing