On the homogenization of the thickness of Cu deposits by means of MHD convection within small dimension cells
Research output: Contribution to journal › Research article › Contributed › peer-review
Contributors
Abstract
The influence of magnetohydrodynamic (MHD) convection on the thickness of an electrochemically deposited copper layer along a vertical plane cathode is examined. A magnetic gradient field, that induces a Lorentz force, establishes a vortical motion of the electrolyte which can be oriented either antiparallel or parallel to the natural convection. For the latter case, we show both experimentally and numerically that a sufficiently strong Lorentz force levels the inhomogeneities of the deposit thickness characteristic for deposition under pure natural convection.
Details
Original language | English |
---|---|
Pages (from-to) | 80-83 |
Number of pages | 4 |
Journal | Electrochemistry Communications |
Volume | 36 |
Publication status | Published - 2013 |
Peer-reviewed | Yes |
External IDs
ORCID | /0000-0003-1653-5686/work/173052431 |
---|---|
ORCID | /0000-0002-4179-2273/work/173053898 |
Keywords
ASJC Scopus subject areas
Keywords
- Electrochemical deposition, Forced convection, Lorentz force, Magnetoelectrochemistry, Mass transport, MHD