Numerical simulations of copper droplet collisions in an electromagnetic slag cleaning process

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contributors

  • J. Fröhlich - (Author)
  • H. Yang - (Author)
  • J. Wolters - (Author)
  • P. Pischke - (Author)
  • H. Soltner - (Author)
  • S. Eckert - (Author)

Details

Original languageEnglish
Publication statusPublished - 2016
Peer-reviewedYes

External IDs

ORCID /0000-0003-1653-5686/work/170585322

Keywords

Keywords

  • MHD, liquid metal droplet, coalescence, copper slag cleaning, stochastic collision