This paper discusses technology development for integration of parallel optical interconnect on board-level. The interchip link is based on planar polymeric optical multimode waveguides and wafer-level out-of-plane coupling optics. Realized on-board waveguides feature low insertion loss with minimum attenuation coefficient of 0.024 dB/cm. Integration of polymeric waveguides on flexible substrate is shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electro-optical printed circuit board (EOPCB). The development of wafer-level coupling optics is described. This optics is based on a glass interposer with integrated waveguides (planar lightwave circuit PLC) and integrated micro-mirrors for light redirection. Passive alignment processes are incorporated for the assembly of optical and optoelectronic components, which enable precise and cost-effective fabrication.