MTPPy: Open-Source AI-friendly Modular Automation
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
Modular Automation offers promising technologies for the process and chemical industry. It meets the requirements for greater flexibility and a shorter development cycle for production facilities by dividing the process into smaller standardized units. Key element of Modular Automation is the Module Type Package (MTP). It represents a standardized and manufacturer-independent description of the automation interface for self-contained production units, or Process Equipment Assemblies (PEA), and endows the plug-and-produce capability of PEAs. Software solutions to program MTP compatible PEAs are mostly provided by the Programmable Logic Controller (PLC) manufacturers. They are proprietary and bound to certain hardware and even programming languages. Therefore, their suitability for implementation of soft sensors based on data-driven advanced analytics is strongly limited. In this article we present an opensource Python package, MTPPy, designed for rapid prototyping of MTP-capable soft sensors with a focus on AI-based research applications. MTPPy is aimed at the accelerated deployment of soft sensors in the modular plants; thus, closing the gap between the data-driven model development and integration into the production.
Details
Original language | English |
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Title of host publication | 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA) |
Publisher | IEEE Computational Intelligence Society (CIS) |
Pages | 1-7 |
Number of pages | 7 |
ISBN (electronic) | 9781665499965 |
ISBN (print) | 978-1-6654-9997-2 |
Publication status | Published - 9 Sept 2022 |
Peer-reviewed | Yes |
Conference
Title | 2022 27th IEEE International Conference on Emerging Technologies and Factory Automation |
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Abbreviated title | ETFA 2022 |
Conference number | 27 |
Duration | 6 - 9 September 2022 |
Website | |
Degree of recognition | International event |
Location | Universität Stuttgart |
City | Stuttgart |
Country | Germany |
External IDs
Scopus | 85141375788 |
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Mendeley | c6a5d7b6-3e0f-34ad-8119-75caaa942c79 |
ORCID | /0000-0001-5165-4459/work/142248261 |
Keywords
Keywords
- Chemical industry, Soft sensors, Raman scattering, Programmable logic devices, Rapid prototyping, Production facilities, Hardware, Advanced Analytics, Artificial Intelligence, Chemical Industry, Modular Plant, Module type package, PEA Engineering, PEA-as-Code, Process Industry, Soft sensor, VDI/VDE/NAMUR 2658