Method for Modifying Substrates Based on Crystal Lattice Dislocation Density

Research output: Intellectual property › Patent application/Patent

Contributors

  • Christian Beyer - (Inventor)
  • Jan Richter - (Inventor)
  • Ralf Rieske - , Infineon Technologies AG (Inventor)
  • Marko Swoboda - , Infineon Technologies AG (Inventor)
  • Albrecht Ullrich - (Inventor)
  • Siltectra GmbH

Abstract

A method includes: providing a semiconductor body having a generation plane and crystal lattice planes which intersect the generation plane at intersecting lines; generating modifications in the semiconductor body by multiphoton excitation and which are spaced apart from one another, the modifications altering a physical property of the semiconductor body so as to form subcritical cracks in the generation plane; and separating a solid-state layer from the semiconductor body by connecting the subcritical cracks in the generation plane.

Details

A method includes: providing a semiconductor body having a generation plane and crystal lattice planes which intersect the generation plane at intersecting lines; generating modifications in the semiconductor body by multiphoton excitation and which are spaced apart from one another, the modifications altering a physical property of the semiconductor body so as to form subcritical cracks in the generation plane; and separating a solid-state layer from the semiconductor body by connecting the subcritical cracks in the generation plane.

Original languageEnglish
IPC (International Patent Classification)H01L 21/ 78 A I
Patent numberUS2020051831
Filing date6 Aug 2019
Country/TerritoryUnited States of America
Priority date7 Aug 2018
Priority numberDE20181006238
Publication statusPublished - 13 Feb 2020
Externally publishedYes
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External IDs

ORCID /0000-0003-2572-1149/work/208796506