Method for Modifying Substrates Based on Crystal Lattice Dislocation Density
Publikation: Geistiges Eigentum › Patentanmeldung/Patent
Beitragende
- Siltectra GmbH
Abstract
A method includes: providing a semiconductor body having a generation plane and crystal lattice planes which intersect the generation plane at intersecting lines; generating modifications in the semiconductor body by multiphoton excitation and which are spaced apart from one another, the modifications altering a physical property of the semiconductor body so as to form subcritical cracks in the generation plane; and separating a solid-state layer from the semiconductor body by connecting the subcritical cracks in the generation plane.
Details
A method includes: providing a semiconductor body having a generation plane and crystal lattice planes which intersect the generation plane at intersecting lines; generating modifications in the semiconductor body by multiphoton excitation and which are spaced apart from one another, the modifications altering a physical property of the semiconductor body so as to form subcritical cracks in the generation plane; and separating a solid-state layer from the semiconductor body by connecting the subcritical cracks in the generation plane.
| Originalsprache | Englisch |
|---|---|
| IPC (Internationale Patentklassifikation) | H01L 21/ 78 A I |
| Veröffentlichungsnummer | US2020051831 |
| Anmeldedatum | 6 Aug. 2019 |
| Land/Gebiet | USA/Vereinigte Staaten |
| Prioritätsdatum | 7 Aug. 2018 |
| Prioritätsnummer | DE20181006238 |
| Publikationsstatus | Veröffentlicht - 13 Feb. 2020 |
| Extern publiziert | Ja |
Externe IDs
| ORCID | /0000-0003-2572-1149/work/208796506 |
|---|