Method for Modifying Substrates Based on Crystal Lattice Dislocation Density

Publikation: Geistiges EigentumPatentanmeldung/Patent

Beitragende

  • Christian Beyer - (Erfinder:in)
  • Jan Richter - (Erfinder:in)
  • Ralf Rieske - , Infineon Technologies AG (Erfinder:in)
  • Marko Swoboda - , Infineon Technologies AG (Erfinder:in)
  • Albrecht Ullrich - (Erfinder:in)
  • Siltectra GmbH

Abstract

A method includes: providing a semiconductor body having a generation plane and crystal lattice planes which intersect the generation plane at intersecting lines; generating modifications in the semiconductor body by multiphoton excitation and which are spaced apart from one another, the modifications altering a physical property of the semiconductor body so as to form subcritical cracks in the generation plane; and separating a solid-state layer from the semiconductor body by connecting the subcritical cracks in the generation plane.

Details

A method includes: providing a semiconductor body having a generation plane and crystal lattice planes which intersect the generation plane at intersecting lines; generating modifications in the semiconductor body by multiphoton excitation and which are spaced apart from one another, the modifications altering a physical property of the semiconductor body so as to form subcritical cracks in the generation plane; and separating a solid-state layer from the semiconductor body by connecting the subcritical cracks in the generation plane.

OriginalspracheEnglisch
IPC (Internationale Patentklassifikation)H01L 21/ 78 A I
VeröffentlichungsnummerUS2020051831
Anmeldedatum6 Aug. 2019
Land/GebietUSA/Vereinigte Staaten
Prioritätsdatum7 Aug. 2018
PrioritätsnummerDE20181006238
PublikationsstatusVeröffentlicht - 13 Feb. 2020
Extern publiziertJa
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Externe IDs

ORCID /0000-0003-2572-1149/work/208796506