METHOD FOR MANUFACTURING AN ORGANIC ELECTRONIC DEVICE AND ORGANIC ELECTRONIC DEVICE
Research output: Intellectual Property › Patent application/Patent
Contributors
- Technische Universität Dresden
- Novaled GmbH
Abstract
The disclosure provides a method of manufacturing an organic electronic device, including providing a layered device structure, the layered device structure including a plurality of electrodes and an electronically active region, said providing of the layered device structure including steps of providing an organic semiconducting layer, applying a structuring layer to the organic semiconducting layer, the structuring layer having a first region and a second region, the first region being covered by a layer material, applying a contact improving layer to the structuring layer by depositing at least one of an organic dopant material and an organic dopant-matrix material at least in the first region, depositing a layer material on the contact improving layer at least in the first region, and removing the structuring layer at least in the second region. Furthermore, an organic electronic device is provided.
Details
The disclosure provides a method of manufacturing an organic electronic device, including providing a layered device structure, the layered device structure including a plurality of electrodes and an electronically active region, said providing of the layered device structure including steps of providing an organic semiconducting layer, applying a structuring layer to the organic semiconducting layer, the structuring layer having a first region and a second region, the first region being covered by a layer material, applying a contact improving layer to the structuring layer by depositing at least one of an organic dopant material and an organic dopant-matrix material at least in the first region, depositing a layer material on the contact improving layer at least in the first region, and removing the structuring layer at least in the second region. Furthermore, an organic electronic device is provided.
Original language | English |
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IPC (International Patent Classification) | H01L 51/ 56 A I |
Patent number | US2016064671 |
Country/Territory | Germany |
Priority date | 25 Mar 2014 |
Priority number | WO2014EP55976 |
Publication status | Published - 3 Mar 2016 |
External IDs
ORCID | /0000-0002-9773-6676/work/142659821 |
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