METHOD FOR MANUFACTURING AN ORGANIC ELECTRONIC DEVICE AND ORGANIC ELECTRONIC DEVICE
Publikation: Geistiges Eigentum › Patentanmeldung/Patent
Beitragende
- Technische Universität Dresden
- Novaled GmbH
Abstract
The disclosure provides a method of manufacturing an organic electronic device, including providing a layered device structure, the layered device structure including a plurality of electrodes and an electronically active region, said providing of the layered device structure including steps of providing an organic semiconducting layer, applying a structuring layer to the organic semiconducting layer, the structuring layer having a first region and a second region, the first region being covered by a layer material, applying a contact improving layer to the structuring layer by depositing at least one of an organic dopant material and an organic dopant-matrix material at least in the first region, depositing a layer material on the contact improving layer at least in the first region, and removing the structuring layer at least in the second region. Furthermore, an organic electronic device is provided.
Details
The disclosure provides a method of manufacturing an organic electronic device, including providing a layered device structure, the layered device structure including a plurality of electrodes and an electronically active region, said providing of the layered device structure including steps of providing an organic semiconducting layer, applying a structuring layer to the organic semiconducting layer, the structuring layer having a first region and a second region, the first region being covered by a layer material, applying a contact improving layer to the structuring layer by depositing at least one of an organic dopant material and an organic dopant-matrix material at least in the first region, depositing a layer material on the contact improving layer at least in the first region, and removing the structuring layer at least in the second region. Furthermore, an organic electronic device is provided.
Originalsprache | Englisch |
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IPC (Internationale Patentklassifikation) | H01L 51/ 56 A I |
Veröffentlichungsnummer | US2016064671 |
Land/Gebiet | Deutschland |
Prioritätsdatum | 25 März 2014 |
Prioritätsnummer | WO2014EP55976 |
Publikationsstatus | Veröffentlicht - 3 März 2016 |
Externe IDs
ORCID | /0000-0002-9773-6676/work/142659821 |
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