Mechanical reinforcement of copper films with ceramic nanoparticles

Research output: Contribution to book/conference proceedings/anthology/reportConference contributionContributedpeer-review

Contributors

Abstract

Metal matrix nanocomposites are promising materials for applications in aerospace, automotive and electronic industries due to their excellent mechanical and physical properties. Here, a new synthesis route is developed for the preparation of ceramic particulate reinforced metal films. The homogeneous distribution of different ceramic nanoparticles (TiO2, TiC and SiC) in the range of 5-10 wt.% into copper films by a wet chemical approach results in metal matrix composites with metallic electrical conductivity and enhanced hardness and wear resistance. Reinforcing material and concentration thereof can be easily varied owing to the polymer precursor memod that is established. Electrical conductivity is marginally impaired compared to pure copper films, but still in the range of metallic conductivity. Hardness is analyzed by nanoindentation of the films. Highest hardness is found for 10 wt.% TiO2 in copper (Hit = 1-39 GPa). Improved wear and scratch resistance are shown by a pencil hardness scratch test (Wolff-Wilborn, ISO 15 184).

Details

Original languageEnglish
Title of host publicationDevelopments in Strategic Materials and Computational Design V
EditorsCharles Lewinsohn, Yanchun Zhou, Jingyang Wang, Waltraud M. Kriven, Kyoung Il Moon, Taejin Hwang, Dongming Zhu
PublisherAmerican Ceramic Society
Pages361-366
Number of pages6
Edition8
ISBN (print)9781119040439
Publication statusPublished - 2014
Peer-reviewedYes

Publication series

SeriesCeramic Engineering and Science Proceedings
Number8
Volume35
ISSN0196-6219

Conference

Title38th International Conference on Advanced Ceramics and Composites
SubtitleDevelopments in Strategic Materials and Computational Design V
Abbreviated titleICACC 2014
Conference number38
Duration26 - 31 January 2014
CityDaytona Beach
CountryUnited States of America

Keywords