Mechanical reinforcement of copper films with ceramic nanoparticles

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

Abstract

Metal matrix nanocomposites are promising materials for applications in aerospace, automotive and electronic industries due to their excellent mechanical and physical properties. Here, a new synthesis route is developed for the preparation of ceramic particulate reinforced metal films. The homogeneous distribution of different ceramic nanoparticles (TiO2, TiC and SiC) in the range of 5-10 wt.% into copper films by a wet chemical approach results in metal matrix composites with metallic electrical conductivity and enhanced hardness and wear resistance. Reinforcing material and concentration thereof can be easily varied owing to the polymer precursor memod that is established. Electrical conductivity is marginally impaired compared to pure copper films, but still in the range of metallic conductivity. Hardness is analyzed by nanoindentation of the films. Highest hardness is found for 10 wt.% TiO2 in copper (Hit = 1-39 GPa). Improved wear and scratch resistance are shown by a pencil hardness scratch test (Wolff-Wilborn, ISO 15 184).

Details

OriginalspracheEnglisch
TitelDevelopments in Strategic Materials and Computational Design V
Redakteure/-innenCharles Lewinsohn, Yanchun Zhou, Jingyang Wang, Waltraud M. Kriven, Kyoung Il Moon, Taejin Hwang, Dongming Zhu
Herausgeber (Verlag)American Ceramic Society
Seiten361-366
Seitenumfang6
Auflage8
ISBN (Print)9781119040439
PublikationsstatusVeröffentlicht - 2014
Peer-Review-StatusJa

Publikationsreihe

ReiheCeramic Engineering and Science Proceedings
Nummer8
Band35
ISSN0196-6219

Konferenz

Titel38th International Conference on Advanced Ceramics and Composites
UntertitelDevelopments in Strategic Materials and Computational Design V
KurztitelICACC 2014
Veranstaltungsnummer38
Dauer26 - 31 Januar 2014
StadtDaytona Beach
LandUSA/Vereinigte Staaten

Schlagworte