Material perspectives of HfO2-based ferroelectric films for device applications

Research output: Contribution to conferencesPaperContributedpeer-review

Contributors

  • Akira Toriumi - , The University of Tokyo (Author)
  • Lun Xu - , The University of Tokyo (Author)
  • Yuki Mori - , The University of Tokyo (Author)
  • Xuan Tian - , The University of Tokyo (Author)
  • Patrick D. Lomenzo - , The University of Tokyo (Author)
  • Halid Mulaosmanovic - , TUD Dresden University of Technology (Author)
  • Monica Materano - , Chair of Nanoelectronics, TUD Dresden University of Technology (Author)
  • Thomas Mikolajick - , Chair of Nanoelectronics, TUD Dresden University of Technology (Author)
  • Uwe Schroeder - , TUD Dresden University of Technology (Author)

Abstract

Ferroelectric HfO2 attracts a huge amount of attention not only for memory and negative capacitance, but also for programmable logic including memory-in-logic and neuromorphic applications. However, the understanding of material fundamentals still needs to be improved. This paper gives material fundamentals and new insights to this ferroelectric material for future device applications. In particular, the key role of dopants, effects of the interface on the ferroelectric phase, and a detailed discussion of the switching kinetics are of central focus. Based on material properties newly obtained, we discuss opportunities of ferroelectric HfO2 for device applications.

Details

Original languageEnglish
Publication statusPublished - Dec 2019
Peer-reviewedYes

Conference

Title2019 Annual IEEE International Electron Devices Meeting
SubtitleInnovative Devices for an Era of Connected Intelligence
Abbreviated titleIEDM 2019
Conference number65
Duration7 - 11 December 2019
Website
CitySan Francisco
CountryUnited States of America

External IDs

ORCID /0000-0003-3814-0378/work/142256224