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Managing Variability within Wafertest Production by Combining Lean and Six Sigma

Research output: Contribution to conferences › Paper › Contributed › peer-review

Contributors

Dietrich Eberts - , Infineon Technologies Dresden GmbH & Co. KG (Author)
Ralph Rottnick - , Infineon Technologies Dresden GmbH & Co. KG (Author)
Germar Schneider - , Infineon Technologies Dresden GmbH & Co. KG (Author)
Rainer Lasch - , Chair of Business Administration, esp Logistics (Author)
Sophia Keil - , Chair of Business Administration, esp Logistics (Author)
Oliver Buhmann - , Dresden University of Applied Sciences (HTW) (Author)

Details

Original language	English
Pages	33-38
Publication status	Published - 2012
Peer-reviewed	Yes

Conference

Title	23rd Annual SEMI Advanced Semiconductor Manufacturing Conference
Abbreviated title	ASMC 2012
Conference number	23
Duration	15 - 17 May 2012
City	Saratoga Springs
Country	United States of America

External IDs

ORCID	/0000-0001-6942-3763/work/142252948
Scopus	84863963041

Keywords

Keywords

Managing Variability, Logistik, Wafertest Production