Low-Loss GSG Bondwire Chip-to-Chip Interconnects from DC to 330 GHz

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

Details

Original languageEnglish
Title of host publication14th IEEE International Conference on Modern Circuits and Systems Technologies (MOCAST) 2025
Number of pages4
Publication statusPublished - Jun 2025
Peer-reviewedYes

Conference

Title14th International Conference on Modern Circuits and Systems Technologies
Abbreviated titleMOCAST 2025
Conference number14
Duration11 - 13 June 2025
Website
LocationTechnische Universität Dresden
CityDresden
CountryGermany