This research work provides a measurement-backed analysis of a single-ended chip-to-chip bondwire interface (BWI) with a signal pattern of ground-signal-ground (GSG) designed for minimum insertion loss. Different approaches to reducing the bondwire length and signal disturbing factors at the intersection of two microchips (such as the scribe lines and sealrings) are investigated and compared. Reproducible, seamless measurements from DC to 330 GHz have successfully demonstrated that GSG bondwire interconnects with only 3 dB insertion loss at 300 GHz can be realized without the need for tailored on-chip structures, which are typically area-intensive and can significantly limit the bandwidth and universal applicability of the chip.