Introduction to optical inter- and intraconnects

Research output: Contribution to book/Conference proceedings/Anthology/ReportChapter in book/Anthology/ReportContributedpeer-review

Contributors

Abstract

Optical systems for data transmission have a history that can be traced back to different roots starting with the invention of the semiconductor laser and the glass fiber in the 1960s. Different application areas such as data center connectivity and long-haul transmission have led to different optical communication solutions. Chip-to-chip communication is a driver for the convergence of these approaches since this is where board-to-board communication and silicon photonics are slated to merge. From the analysis of optical intra-chip and inter-chip systems the required future developments of spectral efficiency, energy efficiency, and packaging can be derived. An overview of the various optical technology options are given in this introductory chapter.

Details

Original languageEnglish
Title of host publication3D Stacked Chips
PublisherSpringer International Publishing
Pages213-220
Number of pages8
ISBN (electronic)9783319204819
ISBN (print)9783319204802
Publication statusPublished - 2016
Peer-reviewedYes

External IDs

ORCID /0000-0002-1851-6828/work/142256654

Keywords

Research priority areas of TU Dresden

Sustainable Development Goals