Introduction to optical inter- and intraconnects

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in Buch/Sammelband/GutachtenBeigetragenBegutachtung

Beitragende

Abstract

Optical systems for data transmission have a history that can be traced back to different roots starting with the invention of the semiconductor laser and the glass fiber in the 1960s. Different application areas such as data center connectivity and long-haul transmission have led to different optical communication solutions. Chip-to-chip communication is a driver for the convergence of these approaches since this is where board-to-board communication and silicon photonics are slated to merge. From the analysis of optical intra-chip and inter-chip systems the required future developments of spectral efficiency, energy efficiency, and packaging can be derived. An overview of the various optical technology options are given in this introductory chapter.

Details

OriginalspracheEnglisch
Titel3D Stacked Chips
Herausgeber (Verlag)Springer International Publishing
Seiten213-220
Seitenumfang8
ISBN (elektronisch)9783319204819
ISBN (Print)9783319204802
PublikationsstatusVeröffentlicht - 2016
Peer-Review-StatusJa

Externe IDs

ORCID /0000-0002-1851-6828/work/142256654

Schlagworte

Forschungsprofillinien der TU Dresden

Ziele für nachhaltige Entwicklung