Interface optimization for improved routability in chip-package-board co-design
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
The simultaneous optimization of both pin assignment and pin routing for different hierarchy levels (chip, package, board) of an electronic system is a bottleneck in today's hierarchical co-design flows, typically requiring manual optimization strategies and multiple iterations. Specifically, a fast and finegrained evaluation of routability that considers all requirements between the different hierarchy levels is missing. In this paper we provide a comprehensive, fast method to evaluate the routability of interfaces in hierarchical systems based on a new probabilistic routability prediction. We implemented our methodology in an industrial design flow and achieved significant improvement in overall routing, including reduced manufacturing costs of chip-package-board co-designs.
Details
Original language | English |
---|---|
Title of host publication | International Workshop on System Level Interconnect Prediction (SLIP) 2011 |
Number of pages | 8 |
Publication status | Published - Jun 2011 |
Peer-reviewed | Yes |
Conference
Title | International Workshop on System Level Interconnect Prediction 2011 |
---|---|
Abbreviated title | SLIP 2011 |
Conference number | 13 |
Duration | 5 June 2011 |
City | San Diego |
Country | United States of America |
External IDs
Scopus | 84857229127 |
---|