Interface optimization for improved routability in chip-package-board co-design
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
The simultaneous optimization of both pin assignment and pin routing for different hierarchy levels (chip, package, board) of an electronic system is a bottleneck in today's hierarchical co-design flows, typically requiring manual optimization strategies and multiple iterations. Specifically, a fast and finegrained evaluation of routability that considers all requirements between the different hierarchy levels is missing. In this paper we provide a comprehensive, fast method to evaluate the routability of interfaces in hierarchical systems based on a new probabilistic routability prediction. We implemented our methodology in an industrial design flow and achieved significant improvement in overall routing, including reduced manufacturing costs of chip-package-board co-designs.
Details
Originalsprache | Englisch |
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Titel | International Workshop on System Level Interconnect Prediction (SLIP) 2011 |
Seitenumfang | 8 |
Publikationsstatus | Veröffentlicht - Juni 2011 |
Peer-Review-Status | Ja |
Konferenz
Titel | International Workshop on System Level Interconnect Prediction 2011 |
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Kurztitel | SLIP 2011 |
Veranstaltungsnummer | 13 |
Dauer | 5 Juni 2011 |
Stadt | San Diego |
Land | USA/Vereinigte Staaten |
Externe IDs
Scopus | 84857229127 |
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