Interconnect Planning for Physical Design of 3D Integrated Circuits
Research output: Book/Conference proceeding/Anthology/Report › Monograph › Contributed › peer-review
Details
| Original language | English |
|---|---|
| Place of Publication | Düsseldorf |
| Publisher | VDI Verlag, Düsseldorf |
| Number of pages | 139 |
| ISBN (print) | 978-3-18-345520-1 |
| Publication status | Published - 2014 |
| Peer-reviewed | Yes |
Publication series
| Series | Fortschritt-Berichte VDI. Reihe 20, Rechnerunterstützte Verfahren |
|---|---|
| Number | 445 |
| ISSN | 0178-9473 |