Inductively excited lock-in thermography for PCB-Vias
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
A novel non-destructive evaluation method of inductively excited lock-in thermography (called InduLIT in this paper) is investigated for crack detection on PCB-vias. Previous publications already showed the working principle. Now the crack inspection of PCB-vias using flat inductors is investigated in detail. FE-models were created to get a better understanding of the process and to find optimum excitation parameters. Planar coil prototypes were produced and InduLIT experiments were performed on test samples. A comparison of the FE-simulations and experiments showed a good correlation.
Details
| Original language | English |
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| Title of host publication | 2012 4th Electronic System-Integration Technology Conference, ESTC 2012 |
| Publisher | IEEE Computer Society |
| ISBN (electronic) | 978-1-4673-4644-3, 978-1-4673-4643-6 |
| ISBN (print) | 978-1-4673-4645-0 |
| Publication status | Published - 2012 |
| Peer-reviewed | Yes |
Conference
| Title | 4th Electronic System-Integration Technology Conference |
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| Abbreviated title | ESTC 2012 |
| Conference number | 4 |
| Duration | 17 - 20 September 2012 |
| City | Amsterdam |
| Country | Netherlands |
External IDs
| ORCID | /0000-0001-9720-0727/work/212490044 |
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