The mobile electrostatic carrier technique, which offers a practical solution for thin-film processing and uses electrostatic forces for reversible attachments of thin and fragile wafers to a rigid substrate, was investigated. The technique offered long duration times for electrostatic clamping during the power disconnection. The mobile wafer support system was derived with the help an electrostatic plate of the size and shape of the wafer and with the capability to maintain the electrostatic attraction. The charging unit was connected to the contact pads to start electrostatic clamping and then disconnected from the power supply. The wafer pair, obtained from the reaction was found to be ready for processing. The technique did not use any polymeric bonding material. The long-term stability of the carrier's polarization state and holding forces were characterized. Results show that the charging status of the carriers remain constant at ambient temperature.