Foreword to the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Proceedings

Research output: Contribution to book/Conference proceedings/Anthology/Report › Foreword/Postscript › Contributed › peer-review

Contributors

Rozalia Beica - , AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (Author)
Karlheinz Bock - , Chair of Electronic Packaging Technology (Author)

Original language	English
Title of host publication	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Place of Publication	San Diego
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	vi-vii
ISBN (electronic)	978-1-6654-7943-1
ISBN (print)	978-1-6654-7944-8
Publication status	Published - 2022
Peer-reviewed	Yes

Series	Electronic Components and Technology Conference (ECTC)
ISSN	0569-5503

Title	72nd IEEE Electronic Components and Technology Conference
Abbreviated title	ECTC 2022
Conference number	72
Duration	31 May - 3 June 2022
Location	The Sheraton San Diego Hotel and Marina
City	San Diego
Country	United States of America

Mendeley	790837a0-4fb6-32b6-991a-04fa585d120d
ORCID	/0000-0002-0757-3325/work/139064785