Energy Efficient Electrical Intra-Chip-Stack Communication

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Contributors

Original language	English
Title of host publication	3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Editors	Ibrahim M. Elfadel, Gerhard Fettweis
Place of Publication	Switzerland
Publisher	Springer
Publication status	Published - 2016
Peer-reviewed	Yes

Scopus	85012233081