Electro-optical integration for VCSEL-based board-level optical chip-to-chip communication

Research output: Contribution to book/conference proceedings/anthology/reportConference contributionContributedpeer-review

Abstract

This paper discusses the technology development for integration of parallel optical interconnects on board-level, including the active and passive optical components as well as the electrical integrated circuitry. The inter-chip link is based on planar polymeric optical multimode waveguides with integrated out-of-plane coupling optics and optical transceiver subassemblies based on glass interposer. Integration of polymeric waveguides on flexible substrates will be shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electrooptical printed circuit board (EOPCB). Realized on-board waveguides feature low insertion loss (minimum attenuation coefficient of below 0.1 dB/cm). For short planar waveguides (Lwaveguide = 9 cm) error free transmission (BER < 10-12) up to 30 Gbit/s was achieved. The development of glass interposer passive optical coupling structures for VCSEL-based short-distance links will be described.

Details

Original languageEnglish
Title of host publicationOptical Fibers and Their Applications (OFTA)
EditorsRyszard S. Romaniuk, Jan Dorosz
PublisherSPIE - The international society for optics and photonics, Bellingham
Volume10325
ISBN (electronic)9781510610958
Publication statusPublished - 2017
Peer-reviewedYes

Publication series

SeriesProceedings of SPIE - The International Society for Optical Engineering
Volume10325
ISSN0277-786X

Conference

Title17th Optical Fibers and Their Applications 2017
Abbreviated titleOFTA 2017
Duration23 - 27 January 2017
CityBialystok, Suprasl
CountryPoland

External IDs

Scopus 85028964299
ORCID /0000-0002-0757-3325/work/139064895
ORCID /0000-0002-1851-6828/work/142256671

Keywords

Research priority areas of TU Dresden

Keywords

  • board-level optical interconnects, glass interposer, optical characterization, Optical packaging, out-of-plane coupling optics, parallel optical interconnects, passive alignment, polymeric optical waveguides