Electronics packaging for microfluidics applications
Research output: Contribution to conferences › Paper › Contributed › peer-review
Contributors
Abstract
Microsystems experience an increasing spreading. Itself this increase will express particularly in new products and procedures. For the employment of microsystems speak in particular a high functionality, combined with small energy consumption as well as increased reliability. These components can be manufactured by mass production low-priced. Apart from prognosticated increases with "classical" microsystem products e.g. acceleration sensors just as increases for biological and physical microsystems become expected. Examples are the discussed "micro totally analysis systems" (muTAS) or "lab the on chip" applications. It concerns it high-complex, fluid microsystems, whose manufacturing requires a strong interdisciplinary cooperation. The paper reports the adaptation of conventional electronic packaging techniques for the production of micro-fluid flow chips from glass, silicon and glass silicon hybrid …
Details
Original language | English |
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Pages | 562 |
Number of pages | 566 |
Publication status | Published - 5 Sept 2006 |
Peer-reviewed | Yes |
Conference
Title | 2006 1st Electronic Systemintegration Technology Conference |
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Duration | 5 - 7 September 2006 |
Location | Dresden, Germany |
External IDs
ORCID | /0000-0002-8588-9755/work/142246776 |
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