Electronics packaging for microfluidics applications

Research output: Contribution to conferencesPaperContributedpeer-review

Contributors

  • Steffen Howitz - , GeSiM – Gesellschaft für Silizium-Mikrosysteme mbH (Author)
  • Lars Rebenklau - , Fraunhofer Institute for Ceramic Technologies and Systems (Author)
  • Andreas Richter - , Chair of Microsystems (Author)

Abstract

Microsystems experience an increasing spreading. Itself this increase will express particularly in new products and procedures. For the employment of microsystems speak in particular a high functionality, combined with small energy consumption as well as increased reliability. These components can be manufactured by mass production low-priced. Apart from prognosticated increases with "classical" microsystem products e.g. acceleration sensors just as increases for biological and physical microsystems become expected. Examples are the discussed "micro totally analysis systems" (muTAS) or "lab the on chip" applications. It concerns it high-complex, fluid microsystems, whose manufacturing requires a strong interdisciplinary cooperation. The paper reports the adaptation of conventional electronic packaging techniques for the production of micro-fluid flow chips from glass, silicon and glass silicon hybrid …

Details

Original languageEnglish
Pages562
Number of pages566
Publication statusPublished - 5 Sept 2006
Peer-reviewedYes

Conference

Title2006 1st Electronic Systemintegration Technology Conference
Duration5 - 7 September 2006
LocationDresden, Germany

External IDs

ORCID /0000-0002-8588-9755/work/142246776