Electronics packaging for microfluidics applications

Publikation: Beitrag zu KonferenzenPaperBeigetragenBegutachtung

Beitragende

  • Steffen Howitz - , GeSiM – Gesellschaft für Silizium-Mikrosysteme mbH (Autor:in)
  • Lars Rebenklau - , Fraunhofer-Institut für Keramische Technologien und Systeme (Autor:in)
  • Andreas Richter - , Professur für Mikrosystemtechnik (Autor:in)

Abstract

Microsystems experience an increasing spreading. Itself this increase will express particularly in new products and procedures. For the employment of microsystems speak in particular a high functionality, combined with small energy consumption as well as increased reliability. These components can be manufactured by mass production low-priced. Apart from prognosticated increases with "classical" microsystem products e.g. acceleration sensors just as increases for biological and physical microsystems become expected. Examples are the discussed "micro totally analysis systems" (muTAS) or "lab the on chip" applications. It concerns it high-complex, fluid microsystems, whose manufacturing requires a strong interdisciplinary cooperation. The paper reports the adaptation of conventional electronic packaging techniques for the production of micro-fluid flow chips from glass, silicon and glass silicon hybrid …

Details

OriginalspracheEnglisch
Seiten562
Seitenumfang566
PublikationsstatusVeröffentlicht - 5 Sept. 2006
Peer-Review-StatusJa

Konferenz

Titel2006 1st Electronic Systemintegration Technology Conference
Dauer5 - 7 September 2006
OrtDresden, Germany

Externe IDs

ORCID /0000-0002-8588-9755/work/142246776