EDA Environments for 3D Chip Stacks
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Details
Original language | English |
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Title of host publication | 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems |
Editors | Ibrahim M. Elfadel, Gerhard Fettweis |
Place of Publication | Switzerland |
Publisher | Springer |
Publication status | Published - 2016 |
Peer-reviewed | Yes |
External IDs
Scopus | 85012127893 |
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