Determination of Curing for Transparent Epoxy Resin Adhesives
Research output: Contribution to conferences › Paper › Contributed › peer-review
Contributors
Abstract
Transparent epoxy resin adhesives are interesting for load-bearing joints in the fields of façade technology and glass construction. Until now, there was a lack of knowledge about the influence of ambient conditions on the curing process of these adhesives. Thus, we present the results of an experimental study performed on two-component, cold-cured and on single-component, cationically cured epoxy resin systems. The analysis refers to the influence of the reaction temperature respectively of the light source on the curing speed, the thermo-mechanical properties and optical characteristics of these adhesives. This paper presents a selection of results of various analysis methods to evaluate these effects. These comprise calorimetric, thermo-mechanical and spectroscopic methods.
Details
Original language | English |
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Pages | 671 - 676 |
Publication status | Published - 2011 |
Peer-reviewed | Yes |
Conference
Title | GPD Finland 2011 |
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Conference number | |
Duration | 17 - 20 June 2011 |
Website | |
Location | |
City | Tampere |
Country | Finland |
External IDs
ORCID | /0000-0001-8714-5963/work/142246822 |
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Keywords
Research priority areas of TU Dresden
DFG Classification of Subject Areas according to Review Boards
Subject groups, research areas, subject areas according to Destatis
Sustainable Development Goals
ASJC Scopus subject areas
Keywords
- adhesive bonding, epoxy resin, thermo mechanical analysis, FTIR spectroscopy, differential scanning calorimetry