Determination of Curing for Transparent Epoxy Resin Adhesives

Research output: Contribution to conferencesPaperContributedpeer-review

Abstract

Transparent epoxy resin adhesives are interesting for load-bearing joints in the fields of façade technology and glass construction. Until now, there was a lack of knowledge about the influence of ambient conditions on the curing process of these adhesives. Thus, we present the results of an experimental study performed on two-component, cold-cured and on single-component, cationically cured epoxy resin systems. The analysis refers to the influence of the reaction temperature respectively of the light source on the curing speed, the thermo-mechanical properties and optical characteristics of these adhesives. This paper presents a selection of results of various analysis methods to evaluate these effects. These comprise calorimetric, thermo-mechanical and spectroscopic methods.

Details

Original languageEnglish
Pages671 - 676
Publication statusPublished - 2011
Peer-reviewedYes

Conference

TitleGPD Finland 2011
Conference number
Duration17 - 20 June 2011
Website
Location
CityTampere
CountryFinland

External IDs

ORCID /0000-0001-8714-5963/work/142246822

Keywords

Research priority areas of TU Dresden

DFG Classification of Subject Areas according to Review Boards

Subject groups, research areas, subject areas according to Destatis

ASJC Scopus subject areas

Keywords

  • adhesive bonding, epoxy resin, thermo mechanical analysis, FTIR spectroscopy, differential scanning calorimetry