Determination of Curing for Transparent Epoxy Resin Adhesives

Publikation: Beitrag zu KonferenzenPaperBeigetragenBegutachtung

Abstract

Transparent epoxy resin adhesives are interesting for load-bearing joints in the fields of façade technology and glass construction. Until now, there was a lack of knowledge about the influence of ambient conditions on the curing process of these adhesives. Thus, we present the results of an experimental study performed on two-component, cold-cured and on single-component, cationically cured epoxy resin systems. The analysis refers to the influence of the reaction temperature respectively of the light source on the curing speed, the thermo-mechanical properties and optical characteristics of these adhesives. This paper presents a selection of results of various analysis methods to evaluate these effects. These comprise calorimetric, thermo-mechanical and spectroscopic methods.

Details

OriginalspracheEnglisch
Seiten671 - 676
PublikationsstatusVeröffentlicht - 2011
Peer-Review-StatusJa

Konferenz

TitelGPD Finland 2011
Veranstaltungsnummer
Dauer17 - 20 Juni 2011
Webseite
Ort
StadtTampere
LandFinnland

Externe IDs

ORCID /0000-0001-8714-5963/work/142246822

Schlagworte

Forschungsprofillinien der TU Dresden

Fächergruppen, Lehr- und Forschungsbereiche, Fachgebiete nach Destatis

Ziele für nachhaltige Entwicklung

ASJC Scopus Sachgebiete

Schlagwörter

  • adhesive bonding, epoxy resin, thermo mechanical analysis, FTIR spectroscopy, differential scanning calorimetry