Determination of Curing for Transparent Epoxy Resin Adhesives
Publikation: Beitrag zu Konferenzen › Paper › Beigetragen › Begutachtung
Beitragende
Abstract
Transparent epoxy resin adhesives are interesting for load-bearing joints in the fields of façade technology and glass construction. Until now, there was a lack of knowledge about the influence of ambient conditions on the curing process of these adhesives. Thus, we present the results of an experimental study performed on two-component, cold-cured and on single-component, cationically cured epoxy resin systems. The analysis refers to the influence of the reaction temperature respectively of the light source on the curing speed, the thermo-mechanical properties and optical characteristics of these adhesives. This paper presents a selection of results of various analysis methods to evaluate these effects. These comprise calorimetric, thermo-mechanical and spectroscopic methods.
Details
Originalsprache | Englisch |
---|---|
Seiten | 671 - 676 |
Publikationsstatus | Veröffentlicht - 2011 |
Peer-Review-Status | Ja |
Konferenz
Titel | GPD Finland 2011 |
---|---|
Veranstaltungsnummer | |
Dauer | 17 - 20 Juni 2011 |
Webseite | |
Ort | |
Stadt | Tampere |
Land | Finnland |
Externe IDs
ORCID | /0000-0001-8714-5963/work/142246822 |
---|
Schlagworte
Forschungsprofillinien der TU Dresden
DFG-Fachsystematik nach Fachkollegium
Fächergruppen, Lehr- und Forschungsbereiche, Fachgebiete nach Destatis
Ziele für nachhaltige Entwicklung
ASJC Scopus Sachgebiete
Schlagwörter
- adhesive bonding, epoxy resin, thermo mechanical analysis, FTIR spectroscopy, differential scanning calorimetry