Design of bendable high-frequency circuits based on short-channel InGaZnO TFTs
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
A unique requirement of flexible electronic systems is the need to simultaneously optimize their electrical and mechanical performance. Amorphous InGaZnO thin-film transistors (TFTs) fabricated on free-standing large-area plastic substrates address this issue by providing a carrier mobility >10 cm 2 /Vs, and bendability down to radii as small as 25 μm. At the same time, limitations such as a constrained minimum lateral feature size, the lack of appropriate p-type materials, or the influence of strain have to be considered when designing circuits. Here, models describing the scaling and bending behavior of flexible InGaZnO TFTs, together with the design of strain insensitive circuits operating at megahertz frequencies are presented.
Details
| Original language | English |
|---|---|
| Title of host publication | IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2019 |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Number of pages | 3 |
| ISBN (electronic) | 978-1-5386-9304-9 |
| ISBN (print) | 978-1-5386-9305-6 |
| Publication status | Published - Jul 2019 |
| Peer-reviewed | Yes |
Publication series
| Series | IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) |
|---|
Conference
| Title | 1st IEEE International Conference on Flexible and Printable Sensors and Systems |
|---|---|
| Abbreviated title | FLEPS 2019 |
| Conference number | 1 |
| Duration | 7 - 10 July 2019 |
| Degree of recognition | International event |
| Location | DoubleTree by Hilton Glasgow Central |
| City | Glasgow |
| Country | United Kingdom |
External IDs
| ORCID | /0000-0001-6429-0105/work/142236598 |
|---|---|
| ORCID | /0000-0002-4152-1203/work/165453362 |