Design of bendable high-frequency circuits based on short-channel InGaZnO TFTs

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

Abstract

A unique requirement of flexible electronic systems is the need to simultaneously optimize their electrical and mechanical performance. Amorphous InGaZnO thin-film transistors (TFTs) fabricated on free-standing large-area plastic substrates address this issue by providing a carrier mobility >10 cm 2 /Vs, and bendability down to radii as small as 25 μm. At the same time, limitations such as a constrained minimum lateral feature size, the lack of appropriate p-type materials, or the influence of strain have to be considered when designing circuits. Here, models describing the scaling and bending behavior of flexible InGaZnO TFTs, together with the design of strain insensitive circuits operating at megahertz frequencies are presented.

Details

Original languageEnglish
Title of host publicationIEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages3
ISBN (electronic)978-1-5386-9304-9
ISBN (print)978-1-5386-9305-6
Publication statusPublished - Jul 2019
Peer-reviewedYes

Publication series

SeriesIEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

Conference

Title1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019
Duration7 - 10 July 2019
CityGlasgow
CountryUnited Kingdom

External IDs

ORCID /0000-0001-6429-0105/work/142236598
ORCID /0000-0002-4152-1203/work/165453362