Design considerations and constraints in silicon based optical on-board interconnects for short range communications
Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review
Contributors
Abstract
In this paper, various trade-offs for the design of short-range optical interconnects for on-board communication in a high-performance computer (HPC) will be discussed. Energy consumption and bandwidth requirements of the components, which are used for the realization of an optical link in future highly adaptive energy-efficient computers, will be estimated based on the energy consumption and bandwidth trends of super computers. A scalable solution and its performance in terms of energy efficiency and bandwidth will be discussed. Results regarding all sub-components of such an optical on-board link are presented including optical components, packaging, and electrical components will be presented in the paper.
Details
| Original language | English |
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| Title of host publication | 19th International Conference on Transparent Optical Networks (ICTON) |
| Place of Publication | Girona |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| ISBN (electronic) | 978-1-5386-0859-3, 978-1-5386-0858-6 |
| ISBN (print) | 978-1-5386-0860-9 |
| Publication status | Published - 2017 |
| Peer-reviewed | Yes |
Publication series
| Series | International Conference on Transparent Optical Networks (ICTON) |
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Conference
| Title | 19th International Conference on Transparent Optical Networks, ICTON 2017 |
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| Duration | 2 - 6 July 2017 |
| City | Girona, Catalonia |
| Country | Spain |
External IDs
| ORCID | /0000-0002-0757-3325/work/139064892 |
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| ORCID | /0000-0002-1851-6828/work/142256651 |
Keywords
Research priority areas of TU Dresden
Sustainable Development Goals
ASJC Scopus subject areas
Keywords
- energy consumption, on-board optical communication, silicon photonic packaging