Design considerations and constraints in silicon based optical on-board interconnects for short range communications

Research output: Contribution to book/conference proceedings/anthology/reportConference contributionContributedpeer-review

Abstract

In this paper, various trade-offs for the design of short-range optical interconnects for on-board communication in a high-performance computer (HPC) will be discussed. Energy consumption and bandwidth requirements of the components, which are used for the realization of an optical link in future highly adaptive energy-efficient computers, will be estimated based on the energy consumption and bandwidth trends of super computers. A scalable solution and its performance in terms of energy efficiency and bandwidth will be discussed. Results regarding all sub-components of such an optical on-board link are presented including optical components, packaging, and electrical components will be presented in the paper.

Details

Original languageEnglish
Title of host publication19th International Conference on Transparent Optical Networks (ICTON)
Place of PublicationGirona
PublisherIEEE Xplore
ISBN (electronic)978-1-5386-0859-3, 978-1-5386-0858-6
ISBN (print)978-1-5386-0860-9
Publication statusPublished - 2017
Peer-reviewedYes

Publication series

SeriesInternational Conference on Transparent Optical Networks

Conference

Title19th International Conference on Transparent Optical Networks, ICTON 2017
Duration2 - 6 July 2017
CityGirona, Catalonia
CountrySpain

External IDs

ORCID /0000-0002-0757-3325/work/139064892
ORCID /0000-0002-1851-6828/work/142256651

Keywords

Research priority areas of TU Dresden

Sustainable Development Goals

Keywords

  • energy consumption, on-board optical communication, silicon photonic packaging