Chemische Gasphasenabscheidung von 2D Übergangsmetall Dichalkogeniden für mikroelektronische Anwendungen

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

  • Jan Lucas Wree - , Ruhr University Bochum (Author)
  • Thomas Berning - , Ruhr University Bochum (Author)
  • Claudia Bock - , Ruhr University Bochum (Author)
  • Anjana Devi - , Ruhr University Bochum (Author)

Abstract

Two-dimensional transition metal dichalcogenides like molybdenum- and tungsten sulfide are semiconducting and promising as active materials in future microelectronic applications like thin-film transistors, sensors, solar cells, and photodetectors. The structural advantages in comparison to other materials are the high mechanical flexibility and stability. Additionally, these materials have band gaps dependent on their film thickness and electronic properties dependent on their crystal structure. Therefore, these materials have already been tested in catalysis and electronic applications. A big challenge for their implementation in industrial applications is the fabrication of large-area 2D materials. Since classical mechanical exfoliation methods are not suitable for the production of large-area films, chemical vapor deposition (CVD) is the method of choice. Herein we report a successfully developed CVD process for MoS2 with a specifically designed molybdenum precursor. The growth of homogeneous and large-area 2H-MoS2 with high purity was confirmed and the suitability as a channel material for transistor structures was tested.

Translated title of the contribution
Chemical vapor deposition of 2D transition metal dichalcogenides for microelectronic applications

Details

Original languageGerman
Title of host publicationMikroSystemTechnik Kongress 2019 - Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings
PublisherVDE Verlag, Berlin [u. a.]
Pages56-59
Number of pages4
ISBN (electronic)9783800751297
Publication statusPublished - 2019
Peer-reviewedYes
Externally publishedYes

Publication series

Series2019 MikroSystemTechnik Kongress (MEMS-MOEMS)

Conference

TitleMikroSystemTechnik Congress 2019: Microelectronics, MEMS-MOEMS, System Integration - Pillars of Digitization and Artificial Intelligence
Duration28 - 30 October 2019
CityBerlin
CountryGermany