Characterisation of reliability of compound semiconductor devices using electrical pulses

Research output: Contribution to journalResearch articleContributedpeer-review

Contributors

  • M. Brandt - , Technische Universität Darmstadt (Author)
  • V. Krozer - , Chemnitz University of Technology (Author)
  • M. Schüßler - , Technische Universität Darmstadt (Author)
  • K. H. Bock - , Interuniversitair Micro-Elektronica Centrum (Author)
  • H. L. Hartnagel - , Technische Universität Darmstadt (Author)

Abstract

Transmission line pulses (TLP) with 0-60V amplitude and 100ns pulse width have been applied for accelerated lifetime tests of GaAs devices. 1/f noise, RF noise and I/V measurements are applicable for the characterisation of the reliability of these devices. Different failure mechanisms can be identified by applying square pulses of varying amplitude and different polarity on a variety of samples. Correlation between anomalies in 1/f noise, RF noise and I/V characteristics has been determined. Using this novel method, the determination of failure threshold levels for current density, electric field and charge carrier temperature is possible and critical spots in device design can be ascertained.

Details

Original languageEnglish
Pages (from-to)1891-1894
Number of pages4
JournalMicroelectronics Reliability
Volume36
Issue number11-12
Publication statusPublished - 1996
Peer-reviewedYes
Externally publishedYes

External IDs

ORCID /0000-0002-0757-3325/work/139064899