Various embodiments provide a component arrangement, said component arrangement comprising: a carrier (102), wherein at least one electronic component (108) is formed in the carrier (102); a first metallization layer (116) over the carrier (102), wherein the first metallization layer (116) has a first metallic coupling structure (122), which is electrically coupled to the at least one electronic component (108); a second metallization layer (128) over the first metallization layer (116), wherein the second metallization layer (128) has a second metallic coupling structure (132), wherein the first metallic coupling structure (122) is coupled to the second metallic coupling structure (132) by means of at least one via (134); and a plurality of additional vias (136, 138), which extend at least between the first metallization layer (116) and the second metallization layer (128) and are electrically conductively coupled to one another in such a way that they form a coil (152), which has a coil region (154) which is at an angle to the main processing surface of the carrier (102).