Assembly of optical transceivers for board-level optical interconnects
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
This paper demonstrates an approach for passive alignment and assembly of link components for board-level very-short range optical interconnects. This interchip optical link is based on planar polymeric multimode waveguides and glassbased electro-optical transceivers. The main aim of the work is the investigation of assembly processes of link components in order to fulfill the tolerance requirements using passive alignment. The optical characterization in regard to the optical coupling between link components will define the tolerances for the alignment process. This optical analysis is based on measurements of spatial coupling characteristics. The influence of assembly tolerances on the coupling efficiency is investigated. Flip-chip assembly of electro-optical devices on the glass interposer and of the glass interposer on optical overlay is presented to prove the implementation of the concept.
Details
Original language | English |
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Title of host publication | Micro-Optics 2016 |
Editors | Hans Zappe, Hugo Thienpont, Jurgen Mohr, Hirochika Nakajima |
Publisher | SPIE - The international society for optics and photonics, Bellingham |
ISBN (electronic) | 9781510601338 |
Publication status | Published - 2016 |
Peer-reviewed | Yes |
Publication series
Series | Proceedings of SPIE - The International Society for Optical Engineering |
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Volume | 9888 |
ISSN | 0277-786X |
Conference
Title | Micro-Optics 2016 |
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Duration | 4 - 5 April 2016 |
City | Brussels |
Country | Belgium |
External IDs
ORCID | /0000-0002-0757-3325/work/139064924 |
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Keywords
ASJC Scopus subject areas
Keywords
- board-level optical interconnects, glass interposer, optical characterization, optical packaging, out-of-plane coupling optics, parallel optical interconnects, passive alignment, polymeric optical waveguides