Analysis of Critical Conditions during Wafer Testing by the Use of the Finite Element Method

Research output: Types of thesis › Doctoral thesis

Contributors

  • Angel Ochoa-Brezmes - (Author)

Details

Original languageEnglish
Qualification levelDr.-Ing.
Awarding Institution
Supervisors/Advisors
  • Breitkopf, Cornelia, Mentor
Publication statusPublished - 2018
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Keywords

Keywords

  • IndentationMicroelectronicsImprint depthElastic-plastic deformationFilm thicknessMechanical reliability