A resolution scalable temperature sensor for wireless systems
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed › peer-review
Contributors
Abstract
A temperature sensor comprising two ring oscillators and a frequency counter for wireless systems is presented in this paper which includes the feature of resolution scaling. The sensing element is embedded into the architecture of the ring oscillators. The sensor IC is fabricated on 130 nm IHP SG13C technology and occupies an area of 0.02 mm 2 . Experimental results show a resolution of 0.009 K/LSB to 0.6 K/LSB according to a conversion rate of 140 Hz to 9 kHz within a temperature range of -25 °C to 125 °C. The total power consumption is 160 μW at 1.2 V supply voltage. The basic of operation, the design and evaluation of the chip are presented.
Details
Original language | English |
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Title of host publication | IEEE MTT-S Latin America Microwave Conference (LAMC) 2016 |
Number of pages | 3 |
Publication status | Published - Dec 2016 |
Peer-reviewed | Yes |
Conference
Title | 1st IEEE MTT-S Latin America Microwave Conference, LAMC 2016 |
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Duration | 12 - 14 December 2016 |
City | Puerto Vallarta |
Country | Mexico |
External IDs
ORCID | /0000-0001-6778-7846/work/142240192 |
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Scopus | 85015965035 |
Keywords
Research priority areas of TU Dresden
Keywords
- A resolution scalable temperature sensor for wireless systems