A resolution scalable temperature sensor for wireless systems

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

A temperature sensor comprising two ring oscillators and a frequency counter for wireless systems is presented in this paper which includes the feature of resolution scaling. The sensing element is embedded into the architecture of the ring oscillators. The sensor IC is fabricated on 130 nm IHP SG13C technology and occupies an area of 0.02 mm 2 . Experimental results show a resolution of 0.009 K/LSB to 0.6 K/LSB according to a conversion rate of 140 Hz to 9 kHz within a temperature range of -25 °C to 125 °C. The total power consumption is 160 μW at 1.2 V supply voltage. The basic of operation, the design and evaluation of the chip are presented.

Details

OriginalspracheEnglisch
TitelIEEE MTT-S Latin America Microwave Conference (LAMC) 2016
Seitenumfang3
PublikationsstatusVeröffentlicht - Dez. 2016
Peer-Review-StatusJa

Konferenz

Titel1st IEEE MTT-S Latin America Microwave Conference, LAMC 2016
Dauer12 - 14 Dezember 2016
StadtPuerto Vallarta
LandMexiko

Externe IDs

ORCID /0000-0001-6778-7846/work/142240192
Scopus 85015965035

Schlagworte

Forschungsprofillinien der TU Dresden

Schlagwörter

  • A resolution scalable temperature sensor for wireless systems