A New Method to Evaluate the In-plane Compression Behavior of Paperboard for the Deep Drawing Process

Research output: Contribution to journal › Research article › Contributed › peer-review

Contributors

  • Alexander Lenske - , Fraunhofer Institute for Process Engineering and Packaging (Author)
  • Tobias Müller - , Chair of Processing Machines/ Processing Technology (Author)
  • Nicole Ludat - , Fraunhofer Institute for Process Engineering and Packaging (Author)
  • Marek Hauptmann - , Fraunhofer Institute for Process Engineering and Packaging, Steinbeis University Berlin (Author)
  • Jens Peter Majschak - , Fraunhofer Institute for Process Engineering and Packaging (Author)

Abstract

To evaluate the influence of different normal pressures and the fiber orientation on the in-plane compression behavior of paperboard during the deep drawing process, a new method was developed. In addition, the influence of the wrinkle formation on the dynamic coefficient of friction and the bending resistance was examined. To evaluate the eligibility of the in-plane compression testing method, a validation strategy was developed to compare the results from the new alternative tests with the punch force profiles from the deep drawing process within an empirical model.

Details

Original languageEnglish
Pages (from-to)2403-2427
Number of pages25
JournalBioresources
Volume17
Issue number2
Publication statusPublished - 2022
Peer-reviewedYes

Keywords

ASJC Scopus subject areas

Keywords

  • 3D-forming, Bending resistance, Deep drawing process, Empirical model, Friction behavior, In-plane compression, Paperboard, Tribocharging