A New Method of Flip Chip Assembly Using a Light Silver Filled Glue

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Contributors

  • Michael Feil - , Fraunhofer Institute for Reliability and Microintegration (Author)
  • Martin Konig - , Fraunhofer Institute for Reliability and Microintegration (Author)
  • Karlheinz Bock - , Chair of Electronic Packaging Technology, Fraunhofer Institute for Reliability and Microintegration (Author)

Abstract

Automated and cost-efficient manufacturing processes are of paramount importance for low-cost mass products. One for a bottle neck of the manufacturing transponder is the present chip assembly. ICs are assembled by flip chip adhesive technology using anisotropic or non-conductive adhesives. Simultaneous, both pressure and temperature are required, meaning a high process engineering complexity for mass products. An adhesive, lightly filled with Ag, is used in the proposed new development. Pressure is required but momentarily during placing the chip. For curing only temperature is used. Contact resistance in the range of mOhm and insulation resistance between neighboring bond pads of >20 MOhm were realised and proved by test chips

Details

Original languageGerman
Title of host publication2006 1st Electronic Systemintegration Technology Conference
PublisherIEEE
Pages540-543
Number of pages4
Volume1
ISBN (print)1-4244-0552-1
Publication statusPublished - 7 Sept 2006
Peer-reviewedYes

Conference

Title2006 1st Electronic Systemintegration Technology Conference
Duration5 - 7 September 2006
LocationDresden, Germany

External IDs

Scopus 42549100330
ORCID /0000-0002-0757-3325/work/139064824

Keywords

Keywords

  • Flip chip, Assembly, Silver, Temperature, Contact resistance, Manufacturing processes, Neck, Transponders, Anisotropic magnetoresistance, Nonconductive adhesives