Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Persons and affiliations
- Susann Rothe - , Chair of Development and Construction in Electromechanical and Electronic Design (Speaker)
Date
24 Apr 2023
Conference
Title | 17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics |
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Subtitle | Stress workshop |
Abbreviated title | IRSP 2023 |
Conference number | 17 |
Duration | 24 - 26 April 2023 |
Website | |
Location | Hotel Elbresidenz |
City | Bad Schandau |
Country | Germany |