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Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines

Activity: Talk or presentation at external institutions/eventsTalk/PresentationContributed

Date

24 Apr 2023

Conference

Title17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics
SubtitleStress workshop
Abbreviated titleIRSP 2023
Conference number17
Duration24 - 26 April 2023
Website
LocationHotel Elbresidenz
CityBad Schandau
CountryGermany