The Size Effect on the Creep Properties of SnAgCu-Solder Alloys: 2007 Proceedings 57th Electronic Components and Technology Conference
Publikation: Beitrag zu Konferenzen › Paper › Beigetragen
Beitragende
Abstract
The paper describes the strategies of characterizing the creep behaviour of SnAg-and SnAgCu-solders through experiments on bulk specimens and on very tiny solder joints. The characteristic behaviour of these different volumes will be explained and rationalized by metallurgical considerations about the specifics of solidification in very small volumes.
Details
Originalsprache | Deutsch |
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Seiten | 548-557 |
Seitenumfang | 10 |
Publikationsstatus | Veröffentlicht - 25 Juni 2007 |
Peer-Review-Status | Nein |
Externe IDs
Scopus | 35348843978 |
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