Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process

Publikation: Beitrag in FachzeitschriftForschungsartikelBeigetragenBegutachtung

Beitragende

Abstract

Lot-to-order matching (LTOM) is a crucial process in semiconductor manufacturing since inefficient allocation and order release have strong adverse effects on factory performance. Although prior research proposes several heuristics for the mathematical optimization of the LTOM process, successful real-world implementations following practical and comprehensive approaches are scarce. Our longitudinal case study addresses that issue by summarizing the results of an extensive research project on the automation and optimization of the LTOM process for 200 mm and 300 mm wafers at Infineon Technologies Dresden. Grounded in Action Design Research, we integrated different research methods to provide meaningful insights into the benefits, challenges, and best practices of our approach. Thereby, we also compare the results for 200 mm and 300 mm wafers. The project had positive impacts on multiple quantitative and qualitative key performance indicators, e.g., throughput, on-time delivery, tool utilization, cycle and working time savings, collaboration, and employee satisfaction. Finally, we provide managerial guidance for similar projects and implications for future research.

Details

OriginalspracheEnglisch
Seiten (von - bis)397-404
FachzeitschriftIEEE Transactions on Semiconductor Manufacturing
Jahrgang35
Ausgabenummer3
PublikationsstatusVeröffentlicht - Aug. 2022
Peer-Review-StatusJa

Externe IDs

Scopus 85132710818
Mendeley 1241a497-212b-3a36-aa8c-79e0509fe3dd
WOS 000836652800008
ORCID /0000-0002-3197-6159/work/142235856
ORCID /0000-0001-6942-3763/work/142252905

Schlagworte

Schlagwörter

  • LTOM, Lot assignment, order release, process automation, real-world case study, wafer-To-order allocation