To enable solder joint fatigue investigations under combined thermo-mechanical and mechanical loads a novel test setup has been developed and is presented in this work. This includes a custom test vehicle (see figure 1) and an according mount as well as a matching measurement setup. The test vehicle is PCB based and is assembled with up to 8 chip resistor components (CC0805). Its strap like layout enables defined solder joint deformations which are accessible for measurement. The test vehicle is equipped with an integrated heater (see figure 4, temperature ramp up with up to 20 K/min) and an in-situ resistance measurement option. The integrated heater is carefully designed to meet the requirement of equal temperatures at all mounted components and a homogeneous temperature distribution at each component position. The according mount was designed for a low thermal mass but high stiffness. This enables fast temperature changes and defined test vehicle deformations. Vibration experiments have been conducted controlling the specimen amplitude to provide a constant specimen deformation. Additionally, to track the specimen deformation during long term experiments an automated data acquisition for deflection and temperature data has been installed. Using the described setup preliminary experiments were accomplished and capacious tests are ongoing to investigate the fatigue behaviour of solder joints. The investigations consider both the ductile SnAg1.0Cu0.5 and the brittle Innolot solder alloy. The experiments include isothermal vibration experiments at room temperature and up to 100°C as well as vibration experiments combined with changing temperature conditions. Solder joint fatigue will be investigated using cross sectioning. Microstructural changes and damage mechanisms are focused in the evaluation. Experimental results extend the knowledge of the solder joint fatigue behaviour for combined load scenarios.