Environmental stress testing has always been an important topic for the electronics industry and several test methods were developed. Among those, mechanical tests like shock and vibration tests are of prior interest in the field of automotive, avionics and industrial electronics since this load type occurs in use conditions. As of today, both mechanical loads are tested separately not necessarily using identical specimens. For shock testing JEDEC B110 or B111 designs and several custom designs, mostly in a rectangular shape, are common. However, with most of these designs efficient failure generation with shaker usage is not possible. This includes the aims of failure mechanism analysis and time to failure data acquisition. This paper shows a newly developed test vehicle suitable for shock as well as other mechanical load conditions and capable of simultaneous testing of multiple components. In the current design version 9 flipchips with a size of 2.9×4.9 mm² were mounted and tested till failure under shock loads with 130 g amplitude and 2 ms pulse width at room temperature. In addition to that, tests were repeated at temperatures of -40 °C and 125 °C. Lifetime data has been acquired through online monitoring of solder joint resistance. Stress levels were monitored through strain gauges at the backside of the test vehicles and allowed for stress monitoring during shock events, which showed a peak-to-peak strain of 820 μm/m at room temperature, 781 μm/m at -40 °C and 742 μm/m at 125 °C. Failure analysis data gathered by cross sectioning after the tests showed crack initiation, propagation and complete cracks near the IMC on both flip-chip side and board side of the solder joints.