Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL Stamp
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Beitragende
Abstract
the presented work demonstrates the fabrication process of the master for nano-imprint lithography (NIL) stamp for multi-mode waveguide (MM-WG) with μ-mirror using hybrid-lithography, which includes a 2-photon-polymerization direct laser writing process (2PP-DLW) for μ-mirror surface and UV-photo lithography for MM-WGs. For the definition of the mirror surface at either end of waveguides in the master stamp, the 2PP-DLW process was used. It offers a lower surface roughness (< 0.1 λ) with fewer processing steps, alignment accuracy of ± 1 μm, prints fine and sharp contours, and relatively faster scanning for a specific material, which makes it the foremost technology over the traditional micro-mirror processes such as the dicing process, moving mask lithography, laser ablation, wet etching, and dry etching. For the fabrication of the waveguide core with rectangular cross-sections in the master stamp, UV mask exposure with SU-8 was used. It is a mass-production and low-cost technique. It gives a smooth structure with 90-degree sidewalls compared to other processes like dry etching, wet etching, mosquito method, and E-beam writing. We demonstrated the design and process of a master pattern with a density range from 0.04 to 0.2 to maintain equal pressure over the stamp in the NIL step for an almost uniform residual thickness layer.
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2023 46th International Spring Seminar on Electronics Technology, ISSE 2023 |
| Herausgeber (Verlag) | IEEE Computer Society |
| ISBN (elektronisch) | 9798350334845 |
| Publikationsstatus | Veröffentlicht - 2023 |
| Peer-Review-Status | Ja |
Publikationsreihe
| Reihe | Proceedings of the International Spring Seminar on Electronics Technology |
|---|---|
| Band | 2023-May |
| ISSN | 2161-2528 |
Konferenz
| Titel | 2023 46th International Spring Seminar on Electronics Technology |
|---|---|
| Untertitel | Revolutionizing the Electronics Ecosystems - Chiplet and Heterogeneous Integration |
| Kurztitel | ISSE 2023 |
| Veranstaltungsnummer | 46 |
| Dauer | 10 - 14 Mai 2023 |
| Webseite | |
| Ort | Politehnica University of Timisoara |
| Stadt | Timisoara |
| Land | Rumänien |
Externe IDs
| ORCID | /0000-0002-0757-3325/work/165454415 |
|---|
Schlagworte
ASJC Scopus Sachgebiete
Schlagwörter
- hybrid-lithography, micro-mirror, multi-mode waveguides (MM-WGs), two-photon polymerization direct laser writing (2PP-DLW), UV lithography