This paper describes advances in hybrid-lithography process, combining UV-lithography for planar, single mode redistribution layer (RDL) and 2-photon-polymerization direct-laser-writing (2PP-DLW) for micro-mirrors inside RDL-opening. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography and need for broadband UV-LED source are presented. Near square core cross sections and smooth sidewalls are achieved. Openings in full stack with steep sidewalls without residual layer are patterned. To optimize 2PP-DLW-process processing window for both OrmoComp and IP-DIP is thoroughly characterized. Roughness measurements prove feasibility even of coarsely printed structure as reflective μ-mirror for 1550 nm wavelength. Finally these results are applied to periscope probe for wafer-level-testing of edge emitting lasers and proof of concept is shown. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with μ-mirror printing is given.