This contribution discusses technology development for the realization of chip-to-chip interconnection based on flexible optical waveguides and additive embedded components. The technology development of additive embedding chip components based on 3D-printing process is described. Two approaches for optical coupling between waveguides and active devices are presented. Both approaches built on the planar polymeric optical multimode waveguides integrated on flexible substrates (PEN-foil). The first optical coupling approach for waveguide-to-chip coupling bases on out-of-plane optics. The second approach for coupling between optical waveguides uses a bidirectional interruption-free waveguide coupler.